Last night, I simulated NVIDIA's next-generation GPU chip Feynman, scheduled for March 16, and analyzed NVIDIA's true intentions, compiling a report for the bosses. In-depth Report: "The Ultimate Shift in AI Computing Power - The Paradigm Shift of 'Light, Storage, and Computing' under the Feynman Architecture" Release Date: March 1, 2026 Core Targets: $NVIDIA, $SK Hynix, #Samsung, $TSM, $AVGO, #中际旭创, #新易盛 Investment Theme: From "Chip Add-ons" to "System-Level Packaging (SiP)" Dimensional Attack Report Summary: Breaking the Physical Limits in Three Dimensions Against the backdrop of the 2026 GTC conference, NVIDIA has officially established the evolutionary path from Rubin (2026) to Feynman (2028). Its core strategic intent is now very clear: through 3D stacking (SoIC) and silicon photonics (CPO) technology, it aims to forcibly "absorb" profits originally belonging to the upstream and downstream of the industry chain (storage, networking) into the GPU packaging, achieving a transformation from chip supplier to "full-stack system contractor." 1. NVIDIA GPU Evolution Path: From "Miniaturization" to "Spatial Stacking" NVIDIA's architectural evolution has entered the physical game of the "post-Moore's Law era": Blackwell (2025): The last generation of 2.5D packaging peak, primarily compatible with 1.6T pluggable optical modules. Rubin (2026): The inaugural year of HBM4. Introduces enhanced 3nm process, attempting logic integration on the Base Die for the first time. Feynman (2028): The ultimate form. Adopts TSMC A16 (1.6nm) process and back power delivery (BSPDN). Core Innovation: Vertically stacking SRAM (LPU Dies) above the GPU. Role Change: The GPU is no longer just a computing unit but an independent system equipped with a "highway (CPO)" and a "super-sized fuel tank (3D SRAM)." 2. Storage (HBM & SRAM) Evolution Path: From "Add-ons" to "Symbiosis" 1. Technological Evolution and Role Transition HBM4 (2026/2027): Interface width doubles from 1024-bit to 2048-bit. The most critical change is the transfer of power from the Base Die (logic base). Storage manufacturers (Hynix/Samsung) must be deeply bound to $TSM to produce 5nm level logic bases. 3D SRAM (2028): The Feynman architecture introduces LPU Dies. This layer of high bandwidth (80-100 TB/s) cache will handle 70% of real-time computing data exchange, causing HBM to degrade from "frequently accessed memory" to "high-capacity background tank." 2. Supply and Demand Calculation: EB-level Black Hole under 40% GPU Growth According to a 40% compound annual growth rate for GPUs, combined with the doubling of single-card HBM capacity (192G \rightarrow 288G \rightarrow 576G): 2026 demand 3.63EB supply 2.8EB, gap 22.9% ...