Samsung and AMD Sign HBM4 Supply Memorandum of Understanding, Collaborating on AI Storage and Computing Samsung Electronics and Advanced Micro Devices (AMD) signed a memorandum of understanding in Pyeongtaek, South Korea, designating Samsung as the primary supplier of the next-generation HBM4 memory chips for AMD's Instinct MI455X data center AI accelerator. The agreement also covers Samsung supplying DDR5 memory for AMD's Helios systems based on the MI455X and the new Venice CPU architecture, with both parties exploring potential wafer foundry collaboration opportunities. AMD CEO Lisa Su and Samsung Co-CEO Jong-Hee Han attended the signing ceremony.